IPC Document Revision Table Updated 2010 - 2011

IPC Document Revision Table Updated 2010 - 2011  

Product ID	Document Name	Status
J-STD-001	Requirements for Soldered Electrical and Electronic Assemblies	Rev. E  4/10 Rev D Amend 1  04/08 Rev D 2/05 Rev. C 3/00 Rev. B 10/96 Rev. A 1/95 Orig. 4/92; Supersedes IPC-S-815
J-STD-001CS	Space Applications Electronic Hardware Addendum for J-STD-001C	4CS 1/04
J-STD-001DS	Space Applications Electronic Hardware Addendum for J-STD-001D	Amend 1 09/09 DS 11/06
IPC-HDBK-001	Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies	Amend 2  10/05 Amend. 1  12/00 Orig. 3/98
SMC-TR-001	An Introduction to Tape Automated Bonding Fine Pitch Technology	Orig. 1/89
IT-WP-001	Myths of E-Commerce	Orig. 9/00
SMC-WP-001	Soldering Capability White Paper Report	Orig. 8/91
SMEMA 1.2	Mechanical Equipment Interface Standard	Update IPC-SMEMA-9851
JP002	Current Tin Whiskers Theory and Mitigation Practices Guideline	Orig.  3/06
J-STD-002	Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires	Rev. C Amend. 1 10/08 Rev. C 12/07 Rev. B  2/03 Rev. A 10/98 Orig. 4/92; Supersedes IPC-S-805
SMC-WP-002	An Assessment of the Use of Lead in Electronic Assembly	Orig. 8/92
J-STD-003	Solderability Tests for Printed Boards	Rev. B  2/07 Rev. A  2/03 Original 4/92; Supersedes IPC-S-804
SMC-WP-003	Chip Mounting Technology	Orig. 8/93
SMEMA 3.1	Fiducial Mark Standard
J-STD-004	Requirements for Soldering Fluxes	Rev. B 12/08 Rev. A  1/04 Orig. 1/95; Supersedes IPC-SF-818
SMC-WP-004	Design for Success	Orig. 4/97
SMEMA 4	Reflow Terms and Definitions	Orig.
J-STD-005	Requirements for Soldering Pastes	Amend. 1  6/96 Orig. 1/95; Supersedes IPC-SP-819
SMC-WP-005	PWB Surface Finishes	Orig. 4/97
IPC-HDBK-005	Guide to Solder Paste Assessment	Orig. 1/06
SMEMA 5	Screen Printing Terms and Definitions	Orig.
J-STD-006	Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications	Rev. B Amends 1 & 2 10/09 Rev. B Amend. 1  6/08 Rev. B  1/06 Rev. A  5/01 Orig. 1/95
SMEMA 6	Electronics Cleaning Terms and Definitions	Orig.
SMEMA 7	Fluid Dispensing Terms and Definitions	Orig.
WP-008	Setting up Ion Chromatography Capability	Orig. 12/05
J-STD-012	Implementation of Flip Chip and Chip Scale Technology	Orig. 1/96
J-STD-013	Implementation of Ball Grid Array and Other High Density Technology	Orig. 7/96
IPC-DRM-18	Component Identification Desk Reference Manual	Rev. H 11/07 Rev. G 9/03 Rev. F 8/01 Rev. E 8/00 Rev. D 7/99 Rev. C 7/98 Rev. B 2/97 Rev. A 4/96 Orig. 9/95
J-STD-020	Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices	Rev D Amend 1  3/08 Rev D  8/07 Rev. C 7/04 Rev. B 7/02 Rev. A 4/99 Orig. 10/96
J-STD-026	Semiconductor Design Standard for Flip Chip Applications	Orig. 8/99
J-STD-027	Mechanical Outline Standard for Flip Chip or Chip Scale Configurations	Orig.  2/03
J-STD-028	Performance Standard for Flip Chip Scale Bumps	Orig. 8/99
J-STD-030	Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages	Orig. 9/05
J-STD-032	Performance Standard for Ball Grid Array Bumps and Columns	Orig. 6/02
J-STD-033	Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices	Rev B Amend 1  1/07 Rev B 10/05 Rev. A 7/02 Orig. 4/99
J-STD-035	Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components	Orig. 4/99
IPC-0040	Optoelectronic Assembly and Packaging Technology	Orig. 5/03
IPC-DRM-40 IPC-DRM-PTH	Through-Hole Solder Joint Evaluation Desk Reference Manual	Rev D 11/05 Renamed to DRM-PTH Rev. E 2/02 Rev. D 7/00 Rev. C 9/99 Rev. B 1/99 Rev. A 8/97 Orig. 5/97
IPC-T-50	Terms and Definitions Interconnecting and Packaging Electronic Circuits	Rev. H  7/08 Rev. G 12/03 Rev. F 6/96 Rev. E 7/92 Rev. D 11/88 Rev. C 3/85 Rev. B 6/80 Rev. A 8/76 Orig. 8/75
IPC-DRM-53	Introduction to Electronics Assembly	Orig. 6/00
IPC-DRM-56 IPC-DRM-WHA	Wire Preparation & Crimping	Rev A 11/06 Renamed DRM-WHA Orig.  7/02
IPC-SC-60	Post Solder Solvent Cleaning Handbook	Rev. A 8/99 Orig. 4/87
IPC-SA-61	Post-Solder Semi-Aqueous Cleaning Handbook	Rev. A 6/02 Orig. 7/95
IPC-AC-62	Post Solder Aqueous Cleaning Handbook	Rev. A 1/96 Orig. 12/86
IPC-CH-65	Guidelines for Cleaning of Printed Boards and Assemblies	Rev. A 9/99 Orig. 12/90
IPC-CS-70	Guidelines for Chemical Handling Safety in Printed Board Manufacturing	Orig. 8/88 Obsolete without replacement
J-STD-075	Classification of Non-IC Electronic Components for Assembly Processes	Orig. 08/08
IPC-CM-78	Guidelines for Surface Mounting and Interconnecting Chip Carriers	Superseded by IPC-SM-780 Rev. C - 3/88 Orig. 11/83
IPC-MP-83	IPC Policy on Metrication	Orig. 8/85 Obsolete without replacement
IPC-PC-90	General Requirements for Implementation of Statistical Process Control	Superseded by IPC-9191 Orig. 10/90
IPC-QS-95	General Requirements for Implementation of ISO 9000 Quality Systems	Obsolete without replacement Orig. 4/93
IPC-L-108	Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards	Superseded by IPC-4101 Rev. B  6/90 Rev. A 10/80 Orig. 3/76
IPC-L-109	Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards	Superseded by IPC-4101 Rev. B  7/92 Rev. A 10/80 Orig. 3/76
IPC-L-110	Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards	Rev. A Superseded by IPC-L-109 and IPC-4101
IPC-CC-110	Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications	Superseded by IPC-4121 Rev. A 12/97 Orig. 1/94
IPC-L-112	Specification for Composite Metal Clad Base materials for Printed Boards	Superseded by IPC-4101 Rev. A 6/92 Orig. 7/81
IPC-L-115	Specification for Rigid Metal Clad Base Materials for Printed Boards	Superseded by IPC-4101 Rev. B 4/90 Rev. A 10/80 Orig. 3/77
IPC-L-120	Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates	Obsolete without replacement
IPC-L-125	Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections	Superseded by IPC-4103 Rev. A 7/92 Orig. 8/83
IPC-L-130	Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards	Superseded by IPC-L-108 and IPC-4101 Orig. 1/77
IPC-DD-135	Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules	Orig. 8/95
IPC-EG-140	Specification for Finished Fabric Woven from "E" Glass for Printed Boards	Superseded by IPC-4412 Amend. 1 & 2 6/97 Orig. 3/88
IPC-SG-141	Specification for Finished Fabric Woven from "S" Glass for Printed Boards	Orig. 2/92
IPC-A-142	Specification for Finished Fabric Woven from Aramid for Printed Boards	Orig. 6/90
IPC-QF-143	General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards	Orig. 2/92
IPC-CF-148	Resin Coated Metal for Printed Boards	Superseded by IPC-4563 Rev. A 9/98 Orig. 6/90
IPC-MF-150	Metal Foil for Printed Wiring Applications	Superseded by IPC-4562 Rev. F 10/91 Changed from CF-150 to MF-150 Rev. E 5/81 Rev. D 3/76 Rev. C 8/74 Rev. B 2/71 Rev. A 9/67 Orig. 8/66
IPC-CF-152	Composite Metallic Material Specification for Printed Wiring Boards	B 12/97 A 1/94 Orig. 6/90
IPC-FC-203	Specification for Flat Cable, Round Conductor, Ground Plane	Obsolete 7/96 Orig. 7/85
IPC-FC-210	Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)	Obsolete 7/96 Orig. 9/85
IPC-FC-213	Performance Specification for Flat Undercarpet Telephone Cable	Obsolete 7/96 Orig. 9/84
IPC-FC-217	General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable	Obsolete 7/96 Reaffirmed 4/90 Orig. 8/82
IPC-FC-218B/EIA-RS-429	General Specification for Connectors, Electrical Flat Cable Type	Obsolete 7/96 Reaffirmed 05/91 Reaffirmed 11/81 Orig. 7/76
IPC-FC-219	Environment Sealed Flat Cable Connectors for use in Aerospace Applications	Obsolete 7/96 Orig. 5/84
IPC-FC-220	Specification for Flat Cable, Flat Conductor, Unshielded	Obsolete 7/96 Rev. C 7/85 Rev. B 8/75 Rev. A 1/74 Orig. 5/70
IPC-FC-221	Specification for Flat-Copper Conductors for Flat Cables	Obsolete 7/96 Rev. A 5/84 Orig. 8/75
IPC-FC-222	Specification of Flat Cable Round Conductor, Unshielded	Obsolete 7/96 Reaffirmed 5/91 Orig. 6/80
IPC-FC-225	Flat Cable Design Guide	Obsolete (date) Reaffirmed 10/85 Orig. 8/75
IPC-FC-231	Flexible Base Dielectrics for Use in Flexible Printed Wiring	Superseded by IPC-4202 Amend. 10/95 Rev. C 4/92 Rev. B 2/86 Rev. A 5/83 Orig. 7/74
IPC-FC-232	Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films	Superseded by 4203 Amend. 10/95 Rev. C 6/94 Rev. B 2/86 Rev. A 5/83 Orig. 7/74
IPC-FC-233	Flexible Adhesive Bonding Films	Incorporated into IPC-FC-232B
IPC-FC-234	PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits	Orig. 12/97
IPC-FC-240	Single sided flex	Superseded by IPC-6013 Incorporated into FC-250 Rev. B 1/74 Rev. A 5/69 Orig. 12/65
IPC-FC-241	Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring	Superseded by IPC-4204 Amend. 10/95 Rev. C 4/92 Rev. B 2/86 Rev. A 5/83 Orig. 7/74
IPC-RF-245	Performance Specification for Rigid-Flex Printed Boards	Superseded by IPC-6013 Orig. 4/87
IPC-D-249	Design Standard for Flexible Single-and Double-Sided Printed Boards	Superseded by IPC-2223 Orig. 1/87
IPC-FC-250A	Specification for Single - and Double-Sided Flexible Printed Wiring	Superseded by IPC-6013 Rev. A 9/86 Orig. 9/86
IPC-FA-251	Guidelines for Single and Double Sided Flex Circuits	Orig. 2/92
IPC-D-275	Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies	Superseded by IPC-2221 and 2222 Supersedes IPC-D-319 and IPC-D-949 Amendment 1  4/96 Orig. 9/91
IPC-RB-276	Qualification and Performance Specification for Rigid Printed Boards	Superseded by IPC-6011 and IPC-6012 Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
IPC-D-279	Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies	Orig. 7/96
IPC-D-300	Printed Board Dimensions and Tolerances	Superseded by IPC-2615 Rev. G 1/84 Rev. F 11/74 Rev. E 10/70 Rev. D 1/70 Rev. C 10/65 Rev. B 1/64 Rev. A 7/61 Orig. 8/60
IPC-D-310	Guidelines for Phototool Generation and Measurement Techniques	Rev. C  6/91 Rev. B 12/85 Rev. A 12/77 Orig. 9/69
IPC-A-311	Process Control Guidelines for Phototool Generation and Use	Orig. 3/96
IPC-D-316	Design Guide for Microwave Circuit Boards Utilizing Soft Substrates	Superseded by IPC-2252 Orig. 5/95
IPC-D-317	Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques	Superseded by IPC-2251 Rev. A 1/95 Orig. 4/90
IPC-HF-318	Microwave End Product Board Inspection and Test	Superseded by IPC-6018 Rev. A 12/91 Orig. 6/85
IPC-D-319	Design Standard for Rigid Single-and Double-Sided Printed Boards	Superseded by IPC-D-275, then by IPC-2221/2222 Orig. 1/87
IPC-SD-320	Performance Specification for Rigid Single- and Double-Sided Printed Boards	Superseded by IPC-RB-276 Supersedes IPC-TC-500 Rev. B 11/86 Rev. A 3/81 Orig. 1/77
IPC-D-322	Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes	Reaffirmed 9/91 Orig. 8/84
IPC-MC-324	Performance Specifications for Metal Core Boards	Superseded by IPC-6011 and IPC-6012 Orig. 10/88
IPC-D-325	Documentation Requirements for Printed Boards, Assemblies and Support Drawings	Rev. A 5/95 Orig. 1/87
IPC-D-326	Information Requirements for Manufacturing Printed Board Assemblies	Rev. A 1/04 Orig. 4/91
IPC-D-330	Design Guide Manual	Orig. 1/92
IPC-PD-335	Electronic Packaging Handbook	Orig. 12/89
IPC-NC-349	Computer Numerical Control Formatting for Drillers and Routers	Orig. 8/85
IPC-D-350	Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1	Rev. D 7/92 Rev. C 10/85 Rev. B 8/77 Rev. A 2/75 Orig. 8/72
IPC-D-351	Printed Board Drawings in Digital Form	Orig. 8/85
IPC-D-352	Electronic Design Data Description for Printed Boards in Digital Form	Orig. 8/85
IPC-D-354	Library Format Description for Printed Boards in Digital Form	Orig. 2/87
IPC-D-355	Printed Board Assembly Description in Digital Form	Orig. 1/95
IPC-D-356	Bare Board Electrical Test Information in Digital Form	Rev. B 10/02 Rev. A 1/98 Orig. 3/92
IPC-AM-361	Specification for Rigid Substrates for Additive Process Printed Boards	Superseded by IPC-4101 Orig. 1/82
IPC-MB-380	Guidelines for Molded Interconnection Devices	Orig. 10/90
IPC-D-390	Automated Design Guidelines	Rev. A 2/88 Orig. 7/74
IPC-C-406	Design and Application Guidelines for Surface Mount Connectors	Orig. 1/90
IPC-CI-408	Design and Application Guidelines for the Use of Solderless Surface Mount Connectors	Orig. 1/94
IPC-BP-421	General Specification for Rigid Printed Board Backplanes with Press Fit Contacts	Obsolete without replacement Reaffirmed 4/90 Orig. 10/80
IPC-D-422	Design Guide for Press Fit Rigid Printed Board Backplanes	Orig. 9/82
IPC-DW-424	General Specification for Encapsulated Discrete Wire Interconnection Boards	Orig. 1/95
IPC-DW-425	Design and End Product Requirements for Discrete Wiring Boards	Rev. A 5/90 Orig. 9/82
IPC-DW-426	Specifications for Assembly of Discrete Wiring	Orig. 12/87
IPC-TR-460	Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards	Rev. A 2/84 Orig. 1973
IPC-TR-461	Solderability Evaluation of Thick and Thin Fused Coatings	Orig. 3/79
IPC-TR-462	Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage	Orig. 10/87
IPC-TR-464	Accelerated Aging for Solderability Evaluations	Rev. A 12/87 Orig. Pub.4/84
IPC-TR-465-1	Round Robin Test on Steam Ager Temperature Control Stability	Orig. 1993
IPC-TR-465-2	The Effect of Steam Aging Time and Temperature on Solderability Test Results	Orig. 1993
IPC-TR-465-3	Evaluation of Steam Aging on Alternative Finishes, Phase IIA	Orig. 7/96
IPC-TR-466	Wetting Balance Standard Weight Comparison Test	Orig. 4/95
IPC-TR-467	Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D	Orig. 10/96
IPC-TR-468	Factors Affecting Insulation Resistance Performance of Printed Boards	Orig. 3/79
IPC-TR-470	Thermal Characteristics of Multilayer Interconnection Boards	Orig. 1/74
IPC-TR-474	An Overview of Discrete Wiring Techniques	Obsolete without replacement Reprint 1984 Orig. 3/79
IPC-TR-476	How to Avoid Metallic Growth Problems on Electronic Hardware Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles	Rev. A 6/84 (new title) Orig. 9/77
IPC-TR-480	Results of Multilayer Test Program Round Robin IV Phase I	Obsolete without replacement Orig. 9/75
IPC-TR-481	Results of Multilayer Test Program Round Robin V	Orig. 4/81
IPC-TR-482	New Developments in Thin Copper Foils	Orig. 1/76
IPC-TR-483	Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program	Rev. A 3/91 Addendums 10/87 Orig. 4/84
IPC-TR-484	Results of IPC Cooper Foil Ductility Round Robin Study	Orig. 4/86
IPC-TR-485	Results of Cooper Foil Rupture Strength Test Round Robin Study	Orig. 3/85
IPC-TR-486	Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations	Orig. 7/01
IPC-TR-549	Measles in Printed Wiring Boards	Orig. 11/78
IPC-TR-551	Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components	Orig. 7/93
IPC-DR-570	General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards	Obsolete without replacement Rev. A 4/84 Orig. 1/79
IPC-DR-572	Drilling Guidelines for Printed Boards	Rev A  3/07 Orig. 4/88
IPC-TR-576	Additive Process Evaluation	Obsolete without replacement Orig. 9/77
IPC-TR-578	Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards	Orig. 9/84
IPC-TR-579	Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards	Orig. 9/88
IPC-TR-580	Cleaning and Cleanliness Test Program Phase 1 Test Results	Orig. 10/89
IPC-TR-581	IPC Phase 3 Controlled Atmosphere Soldering Study	Orig. 8/94
IPC-TR-582	IPC Phase 3 No-Clean Flux Study	Orig. 11/94
IPC-TR-583	An In-Depth Look At Ionic Cleanliness Testing	Orig. 7/02
IPC-WP/TR-584	IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies	Rev A  8-07 Orig.  4/03
IPC-TR-585	Time, Temperature and Humidity Stress of Final Board Finish Solderability	Orig.  5/06
IPC-TR-586	Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A)	Orig. 5/09
IPC-A-600	Acceptability of Printed Boards	Rev. H  4/10 Amend. 1 01/08 Rev. G  7/04 Rev. F 11/99 Rev. E 8/95 Rev. D '89 Rev. C '78 Rev. B '74 Rev. A '70 Orig. '64
IPC-SS-605	Printed Board Quality Evaluation Slide Set	Obsolete without replacement
IPC-QE-605	Printed Board Quality Evaluation Handbook	Rev. A 2/99
J-STD-609	Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices	Rev. A  2/10 Orig. 5/07; supersedes IPC-1066
IPC-A-610	Acceptability of Electronic Assemblies	Rev E  4/10 Rev D Amend 1 4/08 Rev. D 2/05 Rev. C 1/00 Rev. B 12/94 Rev. A 3/90 Orig. 8/83
IPC-A-610DC	IPC-A-610D Telecom Addendum	Orig. 8/09
IPC-HDBK-610	Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)	Amend 1  10/05 Orig. 9/02
IPC-QE-615	Assembly Quality Evaluation Handbook	Obsolete without replacement
IPC/WHMA-A-620	Requirements and Acceptance for Cable and Wire Harness Assemblies	Rev A 7/06 Orig. 1/02
IPC-AI-640	User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates	Obsolete without replacement Orig. 1/87
IPC-AI-641	User's Guidelines for Automated Solder Joint Inspection	Obsolete without replacement Orig. 1/87
IPC-AI-642	User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's	Obsolete without replacement Orig. 10/88
IPC-OI-645	Standard for Visual Optical Inspection Aids	Orig. 10/93
IPC-TM-650	Test Methods Manual	Updated per test method
IPC-ET-652	Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards	Superseded by IPC-9252 Orig. 10/90
IPC-QL-653	Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material	Rev. A 11/97 Orig. 8/88
IPC-MI-660	Incoming Inspection of Raw Materials Manual	Orig. 2/84
IPC-R-700	Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies	Superseded by IPC-7711A/7721A Rev. C 1/88 Rev. B 9/77 Rev. A 12/71 Orig. 9/67
IPC-TA-720	Technology Assessment Handbook on Laminates	Orig. '86
IPC-TA-721	Technology Assessment Handbook on Multilayer Boards	Orig. '88
IPC-TA-722	Technology Assessment of Soldering	Orig. '90
IPC-TA-723	Technology Assessment Handbook on Surface Mounting	Orig. '91
IPC-TA-724	Technology Assessment Series on Cleanrooms	Orig. 4/98
IPC-PE-740	Troubleshooting Guide for Printed Board Manufacture and Assembly	Rev. A 12/97 Orig. 1/85
IPC-CM-770	Printed Board Component Mounting	Rev. E 1/04 Rev. D 1/96 Rev. C 1/87 Rev. B 10/80 Rev. A 3/76 Orig. 9/68
IPC-SM-780	Component Packaging and Interconnecting with Emphasis on Surface Mounting	Orig. 3/88
IPC-SM-782	Surface Mount Design and Land Pattern Standard	Superseded by IPC-7351 Amend. 2  4/99 Amend. 1  10/96 Rev. A 8/93 Orig. 3/87
IPC-SM-784	Guidelines for Chip-on-Board Technology Implementation	Orig. 11/90
IPC-SM-785	Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments	Orig. 11/92
IPC-SM-786	Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs	Superseded by J-STD-020 and J-STD-033 Rev. A 1/95 Orig. 12/90
IPC-MC-790	Guidelines for Multichip Module Technology Utilization	Orig. 8/92
IPC-S-801		Superseded by IPC-804 and J-STD-003
IPC-S-803		Superseded by IPC-804 and J-STD-003
IPC-S-804	Solderability Test Methods for Printed Wiring Boards	Superseded by J-STD-003 Rev. A 1/87 Orig. 1/82
IPC-S-805	Solderability Tests for Component Leads and Terminations	Superseded by J-STD-002 Orig. 1/85
IPC-MS-810	Guidelines for High Volume Microsection	Orig. 10/93
IPC-S-815	General Requirements for Soldering Electronic Interconnections	Superseded byJ-STD-001 Rev. B 12/87 Rev. A 6/81 Orig. 11/77
IPC-S-816	SMT Process Guideline and Checklist	Orig. 7/93
IPC-SM-817	General Requirements for Dielectric Surface Mounting Adhesives	Orig. 11/89
IPC-SF-818	General Requirement for Electronic Soldering Fluxes	Superseded by J-STD-004 Rev. 12/91 Orig. 2/88
IPC-SP-819	General Requirements and Test Methods for Electronic Grade Solder Paste	Superseded by J-STD-005 Orig. 10/88
IPC-AJ-820	Assembly and Joining Manual	Orig. 8/96
IPC-CA-821	General Requirements for Thermally Conductive Adhesives	Orig. 1/95
IPC-CC-830	Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies	Amend. 1 10/08 Rev B 08/02 Amend. 1 7/99 Rev. A 10/98 Orig. 1/84
IPC-HDBK-830	Conformal Coating Handbook	Orig. 10/02
IPC-SM-839	Pre and Post Solder Mask Application Cleaning Guidelines	Orig. 4/90
IPC-SM-840	Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards	Rev. D 4/07 Amend. 1 6/00 Rev. C 1/96 Rev. B 5/88 Rev. A 7/83 Orig. 11/77
IPC-HDBK-840	Solder Mask Handbook	Orig. 09/06
IPC-H-855	Hybrid Microcircuit Design Guide	Obsolete without replacement Orig. 10/82
IPC-D-859	Design Standard for Thick Film Multilayer Hybrid Circuits	Orig. 12/89
IPC-HM-860	Specification for Multilayer Hybrid Circuits	Orig. 1/87
IPC-TF-870	Qualification and Performance of Polymer Thick Film Printed Boards	Orig. 11/89
IPC-ML-910	Design and End Production Specification for Rigid Multilayer Printed Boards	Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011 for End Product Specification Rev. A  8/76 Orig.  6/68
IPC-D-949	Design Standard for Rigid Multilayer Printed Boards	Superseded by IPC-D-275 and subsequently by IPC-2221/2222 Orig. 1/87
IPC-ML-950	Performance Specification for Rigid Multilayer Printed Boards	Superseded by IPC-RB-276 and subsequently IPC-6011/6012 Rev. C 11/8 Rev. B 12/77 Rev. A 9/70 Orig. 1/66
IPC-ML-960	Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards	Orig. 7/94
IPC-ML-975	End Product Documentation Specification for Multilayer Printed Wiring Boards	Superseded by IPC-D-325 Orig. 9/69
IPC-ML-990	Performance Specification for Flexible Multilayer Wiring	Superseded by IPC-6011 Orig. 9/72
IPC-1043	Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1	Orig. 8/92
IPC-1044	Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2	Orig. 10/92
IPC-1065	Material Declaration Handbook	Orig. 1/05
IPC-1066	Labeling of PCBs and Assemblies	Superseded by J-STD-609 Orig. 12/04
IPC-TP-1090	The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002	Orig. 7/96
IPC-TP-1103	Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads	Obsolete without replacement
IPC-TP-1114	The Layman's Guide to Qualifying a Process to J-STD-001B	Orig. 1/98
IPC-TP-1115	Selection and Implementation Strategy for A Low-Residue No-Clean Process	Orig. 12/98
IPC-1131	IT Guidelines for PWB Manufacturers	Orig. 4/00
IPC-1331	Voluntary Safety Standard for Electrically Heated Process Equipment	Orig. 3/00
IPC-1601	Printed Board Handling and Storage Guidelines	Orig. 8/10
IPC-1710	OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)	Rev. A 7/04 12/97 updated Orig. 2/94
IPC-1720	Assembly Qualification Profile (AQP)	Rev. A 7/04 Orig. 7/96
IPC-1730	Laminator Qualification Profile (LQP)	Rev. A 6/00 Orig. 1/98
IPC-1731	Strategic Raw Materials Supplier Qualification Profile	Orig. Pub. 6/00
IPC-1751	Generic Requirements for Declaration Process Management	Rev. A  2/10 Vers. 1.1  3/07 Orig. Pub.  3/06
IPC-1752	Materials Declaration Management (Includes 2 PDF forms)	Rev. A 2/10 Vers. 1.1 3/07 Orig. Pub. 3/06
IPC-1756	Manufacturing Process Data Management	Orig. 4/10
IPC-2141	Controlled Impedance Circuit Boards and High Speed Logic Design	Rev. A 3/04 Orig. 4/96
IPC-2152	Standard for Determining Current Carrying Capacity in Printed Board Design	Orig. 8/09
IPC-2221	Generic Standard on Printed Board Design	Rev. A 5/03 Amend. 1 01/00 Orig. 2/98; Supersedes IPC-D-275
IPC-2222	Sectional Design Standard for Rigid Organic Printed Boards	Orig. 2/98; Supersedes IPC-D-275
IPC-2223	Sectional Design Standard for Flexible Printed Boards	Rev. B 5/08 Rev. A 6/04 Orig. 11/98; Supersedes IPC-D-249
IPC-2224	Sectional Standard for Design of PWBs for PC Cards	Orig. 1/98
IPC-2225	Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies	Orig. 5/98
IPC-2226	Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures	Orig. 4/03
IPC-2251	Design Guidelines for Electronic Packaging Utilizing High Speed Techniques	Orig. 12/03
IPC-2252	Design and Manufacturing Guide for RF/Microwave Circuit Boards	Orig. 7/02
IPC/JPCA-2315	Design Guide for High Density Interconnects (HDI) and Microvia	Orig. 6/00
IPC-2316	Design Guide for Embedded Passive Device Printed Boards	Orig. 3/07
IPC-2501	Definition for Web-based Exchange of XML Data	Orig. 7/03
IPC-2511	Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology	Rev. B  1/02 Rev A  1/00 Orig. 1 1/98
IPC-2512	Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description	Rev A 11/00 Orig. 11/98
IPC-2513	Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description	Rev A 11/00
IPC-2514	Sectional Requirements for Implementation of Printed Board Manufacturing Data Description	Rev A 11/00
IPC-2515	Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description	Rev A 11/00
IPC-2516	Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description	Rev A 11/00
IPC-2517	Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description	Rev A 11/00
IPC-2518	Sectional Requirements for Implementation of Part List Product Data Description	Rev A 11/00
IPC-2524	PWB Fabrication Data Quality Rating System	Orig. 2/99
IPC-2531	Standard Recipe File Format Specification	Orig. 3/99
IPC-2541	Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication	Orig. 10/01
IPC-2546	Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication	Amend. 1  01/03 Amend. 2  01/05 Orig. 10/01
IPC-2547	Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication	1/02
IPC-2571	Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)	11/01
IPC-2576	Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Exchange (PDX)	11/01
IPC-2578	Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)	11/01
IPC-2581	Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring)	Amend 1  5/07 Orig. 3/04
IPC-2582	Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description	Orig. 5/07
IPC-2583	Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description	Orig. 5/07
IPC-2584	Sectional Requirements for Implementation of Printed Board Fabrication Data Description	Orig. 5/07
IPC-2588	Sectional Requirements for Implementation of Part List Product Data Description	Orig. 5/07
IPC-2611	Generic Requirements for Electronic Product Documentation	Orig. 4/10
IPC-2612	Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)	Orig. 4/10
IPC-2612-1	Sectional Requirements for Electronic Diagramming Symbol Generation Methodology	Orig. 4/10
IPC-2614	Sectional Requirements for Board Fabrication Documentation	Orig. 4/10
IPC-2615	Printed Board Dimensions and Tolerances	Orig. 6/00; Supersedes IPC-D-300
IPC-3406	Guidelines for Electrically Conductive Surface Mount Adhesives	Orig. 7/96
IPC-3408	General Requirements for Anistropically Conductive Adhesive Films	Orig. 11/96
IPC-4101	Specification for Base Materials for Rigid and Multilayer Boards	Rev. C 8/09 Rev. B Amends 1&2  4/07 Rev. B Amend 1  2/07 Rev. B  6/06 Rev. A Amend 1 6/02 Rev. A 6/02 Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115 Orig. 12/97
IPC-4103	Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection	Orig. 01/02; Supersedes IPC-L-125
IPC/JPCA-4104	Specification for High Density Interconnect (HDI) and Microvia Materials	Orig. 5/99
IPC-4110	Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards	Orig. 8/98
IPC-4121	Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications	Orig. 1/00; Supersedes IPC-CC-110A
IPC-4130	Specification and Characterization Methods for Nonwoven "E" Glass Mat	Orig. 9/98
IPC-4202	Flexible Base Dielectrics for Use in Flexible Printed Wiring	Rev. A  4/10 Orig. 5/02; Supersedes IPC-FC-231C
IPC-4203	Adhesive Coated Dielectric Films for Use as Cover Sheets	Orig. 5/02; Supersedes IPC-FC-232C
IPC-4204	Flexible Metal-Clad Dielectrics for Use in Fabrication of	Orig. 5/02; Supersedes IPC-FC-241C
IPC-4411	Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement	Rev. A 11/03 Orig. 4/99
IPC-4412	Specification for Finished Fabric Woven form "E" Glass for Printed Boards	Rev. A Amend 2  5/09 Rev. A Amend 1  3/08 Rev. A 1/06 Orig. 6/02; Supersedes IPC-EG-140A
IPC-4552	Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards	Orig. 10/02
IPC-4553	Specification for Immersion Silver Plating for Printed Circuit Boards	Rev. A 5/09 Orig. 6/05
IPC-4554	Specification for Immersion Tin Plating for Printed Circuit Boards	Orig. 2/07
IPC-4562	Metal Foil for Printed Wiring Applications	Rev. A 4/08 Amend. 1  5/05 Orig. 5/00; Supersedes IPC-MF-150F
IPC-4563	Resin Coated Copper Foil for Printed Boards Guideline	Orig. (replaces CF-148A) 11/07
IPC-4761	Design Guide for Protection of Printed Board Via Structures	Orig. 7/06
IPC-4781	Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks	Orig. 5/08
IPC-4811	Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards	Orig. 4/08
IPC-4821	Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards	Amend. 1  4/10 Orig. 5/06
IPC-5701	Users Guide for Cleanliness of Unpopulated Printed Boards	Orig. 7/03
IPC-5702	Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards	Orig. 6/07
IPC-5704	Cleanliness Requirements for Unpopulated Printed Boards	Orig. 12/09
IPC-6011	Generic Performance Specification for Printed Boards	Orig. 7/96
IPC-6012	Qualification and Performance Specification for Rigid Printed Boards	Rev. C  4/10 Amend. 2  3/08 Rev. B with Amend 1  2/07 Rev. B 8/04 Amend. 1  7/00 Rev. A  10/99 Orig.  7/96
IPC-6013	Qualification and Performance Specification for Flexible Printed Boards	Rev B.  1/09 Rev. A with Amend. 2  4/06 Amend. 1  1/05 Rev. A  11/03 Supersedes IPC-RF-245 and IPC-FC-250 Amend. 1  4/00 Orig. 11/98
IPC-6015	Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures	Orig. 2/98
IPC-6016	Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards	Orig. 5/99
IPC-6017	Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices	Orig. 3/09
IPC-6018	Microwave End Product Board Inspection and Test	Rev. A  1/02 Orig. 1/98
IPC/JPCA-6202	Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards	Orig. 2/99
IPC/JPCA-6801	Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection	Orig. 1/00
IPC-7094	Design and Assembly Process Implementation for Flip Chip and Die Size Components	Orig. 1/09
IPC-7095	Design and Assembly Process Implementation for BGAs	Rev. B  3/08 Rev. A 11/04 Orig. 8/00
IPC-7351	Generic Requirements for Surface Mount Design and Land Pattern Standard	Rev. B 6/10 Rev. A  2/07 Supersedes IPC-SM-782A with Amendments 1 & 2 Orig.  2/05
IPC-7525	Guidelines for Stencil Design	Rev. A  2/07 Orig.  5/00
IPC-7526	Stencil and Misprinted Board Cleaning Handbook	Orig.  2/07
IPC-7530	Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes	Orig.  5/01
IPC-7711/7721	Rev B renamed to: Rework, Repair and Modification of Electronic Assemblies	Rev B  11/07 Rev A  10/03 Orig.  4/98; Supersedes IPC-R-700C
IPC-7912	Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies	Rev. A  1/04 Orig.  7/00
IPC-8413-1	Specification for Manufacturing Process Carriers for Handling Optical Fiber	Orig.  4/03
IPC-8497-1	Cleaning Methods and Contamination Assessment for Optical Assembly	Orig. 12/05
IPC-9151	Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database	Rev. C 5/10 Rev. B  2/07 Rev. A 5/03 Orig.  6/02
IPC-9191	General Guideline for implementation of Statistical Process Control (SPC)	Supersedes IPC-PC-90 Orig. 11/99
IPC-9194	Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline	Orig.  9/04
IPC-9199	SPC Quality Rating	Orig.  9/02
IPC-9201	Surface Insulation Resistance Handbook	Rev A  8/07 Orig.  7/96
IPC-9251	Test Vehicles for Evaluating Fine Line Capability	Orig.  7/00
IPC-9252	Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards	Rev. A  11/08 Orig. 02/01; Supersedes IPC-ET-652A
IPC-9261	In-Process DPMO and Estimated Yield for PWAs	Rev. A 10/06 Orig. 3/02
IPC-9501	PWB Assembly Process Simulation for Evaluation of Electronic Components	Orig. 7/95
IPC-9502	PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components	Orig. 4/99
IPC-9503	Moisture Sensitivity Classification for Non-IC Components	Superseded by J-STD-075 08/08 Orig. 4/99
IPC-9504	Assembly Process Simulation for Evaluation of Non-IC Components	Orig. 6/98
IPC-9591	Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices	Orig.  4/06
IPC-9592	Requirements for Power Conversion Devices for the Computer and Telecommunications Industries	Rev. A  5/10 Orig.  9/08
IPC-9691	User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)	Rev A  8/07 Orig. 10/05
IPC-9701	Qualification and Performance Test Methods for Surface Mount Solder Attachments	Rev. A  2/06 Orig.  1/02
IPC/JEDEC-9702	Monotonic Bend Characterization of Board-Level Interconnects	Orig.  6/04
IPC/JEDEC-9703	Mechanical Shock Test Guidelines for Solder Joint Reliability	Orig.  3/09
IPC/JEDEC-9704	Printed Wiring Board Strain Gage Test Guideline	Orig.  6/05
IPC-9850	Surface Mount Equipment Performance Characterization	Orig.  7/02
IPC-SMEMA-9851	Equipment Interface Specification	Orig. 11/04
IPC-DRM-SMT	Surface Mount Solder Joint Evaluation Desk Reference Manual	Rev. C 11/05 Rev. B 4/00 Rev. A 3/99 Orig. 7/98
IPC-EMSI-TC	IPC Sample Master Ordering Agreement for EMS Companies and OEMs	Orig.  3/02
Roadmap	International Technology Roadmap for Electronic Interconnections	Updated 2009 Updated 2007 Updated 2005 Updated 2003 Updated 2001 Updated 9/97 Orig. 6/95

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IPC A-610E 2010 Acceptability of Electronic Assemblies (IPC-A-610E-2010 Revision E)

Product Code: A-610E
Language: English

The IEC is in the process of endorsing IPC-A-610 as the globally preferred international acceptance standard for electronics assembly.

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001. 400 pages. Released April 2010.

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Handbook on Business Process Management 2 : Strategic Alignment, Governance, People and Culture. 1st Edition. 2010; [vom Brocke, Jan; Rosemann, Michael (Eds.)]; ( ISBN: 978-3-642-01981-4 )

vom Brocke, Jan; Rosemann, Michael (Eds.)
1st Edition., 2010, XIX, 616 p., Hardcover
ISBN: 978-3-642-01981-4
Series: International Handbooks on Information Systems

Gives a comprehensive understanding of Business Process Management Covers the six main components of Business Process Management, i. e. strategic alignment, governance, methods, information technology, people and culture Key features are the overall composition of the content based on a well-defined maturity model and the outstanding quality of the contributors.

Business Process Management (BPM) has become one of the most widely used approaches for the design of modern organizational and information systems. The conscious treatment of business processes as significant corporate assets has facilitated substantial improvements in organizational performance but is also used to ensure the conformance of corporate activities. This Handbook presents in two volumes the contemporary body of knowledge as articulated by the world's leading BPM thought leaders. This second volume focuses on the managerial and organizational challenges of Business Process Management such as strategic and cultural alignment, governance and the education of BPM stakeholders. As such, this book provides concepts and methodologies for the integration of BPM. Each chapter has been contributed by leading international experts. Selected case studies complement their views and lead to a summary of BPM expertise that is unique in its coverage of the most critical success factors of BPM.

"The practice of Business Process Management has progressed significantly since Michael Hammer and I wrote the Reengineering book. This Handbook presents the most complete description of the competencies required for BPM and exhaustively describes what we have learned about process management in the last 20 years." Jim Champy

Content Level » Research
Keywords » Business Process Management - Change Management - Organizational Management - Process Modelling - Workflow Management
Related subjects » Business Information Systems - Database Management & Information Retrieval

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Handbook on Business Process Management 1 : Introduction, Methods, and Information Systems. 1st Edition., 2010; [vom Brocke, Jan; Rosemann, Michael (Eds.)]; (ISBN: 978-3-642-00415-5 )

vom Brocke, Jan; Rosemann, Michael (Eds.)
1st Edition., 2010, XIX, 600 p., Hardcover
ISBN: 978-3-642-00415-5
Series: International Handbooks on Information Systems

Gives a comprehensive understanding of Business Process Management Covers the six main components of Business Process Management, i. e. strategic alignment, governance, methods, information technology, people and culture Key features are the overall composition of the content based on a well-defined maturity model and the outstanding quality of the contributors.

Business Process Management (BPM) has become one of the most widely used approaches for the design of modern organizational and information systems. The conscious treatment of business processes as significant corporate assets has facilitated substantial improvements in organizational performance but is also used to ensure the conformance of corporate activities. This Handbook presents in two volumes the contemporary body of knowledge as articulated by the world' s leading BPM thought leaders. This first volume focuses on arriving at a sound definition of Business Process Management approaches and examines BPM methods and process-aware information systems. As such, it provides guidance for the integration of BPM into corporate methodologies and information systems. Each chapter has been contributed by leading international experts. Selected case studies complement these views and lead to a summary of BPM expertise that is unique in its coverage of the most critical success factors of BPM.

"The practice of Business Process Management has progressed significantly since Michael Hammer and I wrote the Reengineering book. This Handbook presents the most complete description of the competencies required for BPM and exhaustively describes what we have learned about process management in the last 20 years." Jim Champy

Content Level » Research

Keywords » Business Process Management - Change Management - Organizational Management - Process Modelling - Workflow Management

Related subjects » Business Information Systems - Database Management & Information Retrieval

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Martindale : The Complete Drug Reference . Thirty-seventh edition - 37th Edition - April 2011 - Book - COMING SOON

Edited by Sean C Sweetman

Book

ISBN: 0263-5364
ISBN: 978 0 85369 933 0
Publishing: Apr 2011
Hardback
276 x 219mm (4160pp)

Also available
Martindale 37th Edition, Book + 1-Year Online Access Package

Martindale is your choice for unbiased, global, and easily accessible drug information. This new edition includes proprietary preparations for 41 countries and regions...offering the widest possible coverage of drugs in use internationally.

NEW in the Martindale 37th Edition· All entries revised and revalidated
· UNII codes added (FDA's Unique Ingredient Identifiers)
· Over 200 new monographs
· Herbal ATC codes added
· New chapters on Pharmaceutical Excipients

International coverage
Martindale continues to be unequalled in its ability to help you identify foreign drugs and assess whether they are available in your country. Access to a multilingual lexicon of pharmaceutical terms is now available. And details on proprietary preparations and their uses are included for over 41 countries.

Contextual informationMartindale provides a broad overview of pharmaceutical topics in a print format that can be easily browsed.

· Introductory abstracts to acquaint the user with each topic
· Restrictions by the World Anti-Doping Agency
· Molecular structural formulae supporting research and teaching
· Primary references for further investigation
· Treatment reviews assess drugs within the context of treatment

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Revista do Instituto de Medicina Tropical de São Paulo (Journal of the Institute of Tropical Medicine of São Paulo), Volume 52 / 2011 (ISSN 0036-4665 printed version - ISSN 1678-9946 online version)

ISSN 0036-4665 printed version
ISSN 1678-9946 online version

The Revista do Instituto de Medicina Tropical de São Paulo (Journal of the Institute of Tropical Medicine of São Paulo) was created in 1959 by professor Luiz Rey, the editor until 1964 when he was succeeded by Prof. Carlos da Silva Lacaz. Professor Thales de Brito became the editor in September 1985, and in 1996, he was joined by professor Dr. Pedro Paulo Chieffi as an associate editor.

Published in English, the journal is devoted mainly to articles dealing with research on tropical diseases and related sciences. Published bimonthly since 1959 without interruption, the Revista do Instituto de Medicina Tropical de São Paulo is distributed to major Brazilian and international research centers and to Universities, Hospitals etc., representing one of the oldest Brazilian publications in this area.

Rev. Inst. Med. Trop. São Paulo is the abbreviated title of the journal that is to be used in references, bibliographies, footnotes and bibliographical strips.

A Revista do Instituto de Medicina Tropical de São Paulo foi criada em 1959 pelo professor Luiz Rey, seu editor até 1964 quando foi sucedido pelo Prof. Carlos da Silva Lacaz. O professor Thales de Brito tornou-se o editor em setembro de 1985, e em 1996, juntou-se a ele o professor Dr. Pedro Paulo Chieffi como editor associado.

Publicada em inglês, a revista é dedicada principalmente a divulgar artigos que tratem de pesquisa em doenças tropicais e ciências relacionadas. A revista, que tem periodicidade bimestral, sendo publicada sem interrupção desde 1959, é distribuída aos principais centros de pesquisa brasileiros e internacionais, e também a universidades, hospitais etc., constituindo-se uma das mais antigas publicações brasileiras na área.

Rev. Inst. Med. Trop. São Paulo é a abreviatura do título da revista para ser usada em referências, bibliografias, notas de rodapé e legendas bibliográficas.

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Arquivos Brasileiros de Cardiologia. Volume 96 - 2011, (ISSN 0066-782X printed version - ISSN 1678-4170 online version) - [Sociedade Brasileira de Cardiologia - Brazilian Society of Cardiology]

Volume 96 - 2011
ISSN 0066-782X printed version
ISSN 1678-4170 online version

The journal Arquivos Brasileiros de Cardiologia is the monthly publication of the Sociedade Brasileira de Cardiologia (Brazilian Society of Cardiology) since 1948.

The journal publishes articles on cardiovascular topics, including new investigations, clinical or surgical experiments, or other original contributions.

Its abbreviated title is Arq. Bras. Cardiol., which should be used in bibliographies, footnotes and bibliographical references and strips.

Eight thousand copies of the printed version of the Arquivos Brasileiros de Cardiologia, the journal published by Sociedade Brasileira de Cardiologia, are monthly released.

Publicação mensal com artigos relatando as mais recentes descobertas e pesquisas no campo da medicina cardiovascular.

Com mais de 60 anos de existência, os Arquivos Brasileiros de Cardiologia (Arq Bras Cardiol) são a publicação científica oficial da Sociedade Brasileira de Cardiologia (SBC) e o principal veículo de divulgação das pesquisas científicas nacionais na área das ciências cardiovasculares.

Indexado nas principais bases de dados internacionais (ISI Web of Science; Cumulated Index Medicus - MEDLINE; EMBASE; SCOPUS; SCIELO e LILACS), os Arquivos Brasileiros de Cardiologia tiveram o seu primeiro fator de impacto recentemente publicado pela Thompson Reuters. O fator de impacto de 1,316 coloca nossa revista à frente ou no mesmo patamar de mais de 40% dos periódicos indexados no ISI Web of Science na área de Cardiologia. Os Arquivos são classificados atualmente como Qualis B1 ou B2 de acordo com a área de Avaliação da Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (Capes), situação que colabora para uma melhor pontuação dos Programas de Pós-Graduação com linhas de pesquisa em ciências cardiovasculares.

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Brazilian Journal of Cardiovascular Surgery - Revista Brasileira de Cirurgia Cardiovascular - Volume 26, 2011(ISSN 0102-7638 printed version - ISSN 1678-9741 online version) - Official publication of the Sociedade Brasileira de Cirurgia Cardiovascular

Volume 26, 2011
ISSN 0102-7638 printed version
ISSN 1678-9741 online version

The printed version of the Revista Brasileira de Cirurgia Cardiovascular – RBCCV is published quarterly.

The Revista Brasileira de Cirurgia Cardiovascular – RBCCV is the official organ of the Sociedade Brasileira de Cirurgia Cardiovascular – SBCCV (Brazilian Society for Cardiovascular Surgery), association that was founded in 1969 as the Departamento de Cirurgia Cardiovascular of the Sociedade Brasileira de Cardiologia – SBC, congregating the Brazilian cardiovascular surgeons, having Professor E. J. Zerbini as its president, and Professor Adib D. Jatene as its general secretary.

In December 1984, that Department was transformed into Sociedade Brasileira de Cirurgia Cardiovascular, having in its statute the foundation of a periodical to be the official organ of the new society.

The Revista Brasileira de Cirurgia Cardiovascular was launched in August 1986, having been published two issues in that year. Its editor was Adib D. Jatene, and its executive editor was Lylian G. de Vasconcellos.

From 1987 to 1991 the journal was published three times a year, and from 1992 up to the present it has been published quarterly (four times a year). The RBCCV is published uninterruptedly since 1986, and distributed free of charge to all Society members, with an edition of 2 thousand copies.

The aim of the journal is to publish representative works related to the cardiovascular surgery, including original papers, research results, actualizations, case reports, as well as papers presented at the Congresses of the Brazilian Society of Cardiovascular Surgery.

The abbreviated title of the journal is Rev Bras Cir Cardiovasc, which should be used in bibliographies, footnotes, bibliographical references and legends.

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Pesquisa Agropecuária Brasileira – PAB - Volume 46 - 2011 - ISSN 1678-3921

ISSN 1678-3921

A revista Pesquisa Agropecuária Brasileira – PAB – é editada mensalmente pela Empresa Brasileira de Pesquisa Agropecuária – Embrapa –, vinculada ao Ministério da Agricultura, Pecuária e Abastecimento. Destina-se à divulgação de trabalhos técnico-científicos originais, inéditos, resultantes de pesquisas ligadas à agropecuária tais como Fisiologia Vegetal, Fitossanidade, Fitotecnia, Genética, Solos, Tecnologia de Alimentos e Zootecnia. É indexada pelo ISI (Web of Science e Current Contents: Agriculture, Biology & Environmental Science), CAB Abstracts e AGRIS.

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Revista Acta Botanica Brasilica, Vol. 25, 2011 (ISSN 0102-3306 versão impressa - ISSN 1677-941X versão online)

ISSN 0102-3306 versão impressa
ISSN 1677-941X versão online

A Acta Botanica Brasilica é o periódico científico publicado sob a responsabilidade da Sociedade Botânica do Brasil (SBB), tendo sido criado em 1987. Vem regularmente publicando um volume por ano que, até 1997, contava com dois fascículos. Em 1998, a revista passou a ter periodicidade quadrimestral (três fascículos por ano: abril, agosto e dezembro) e, a partir de 2001, periodicidade trimestral (quatro fascículos por ano: março, junho, setembro e dezembro). A Acta Botanica Brasilica publica artigos originais em todas as áreas da Botânica, básica ou aplicada, em Português, Espanhol ou Inglês. Os trabalhos deverão ser motivados por uma pergunta central que denote a originalidade e o potencial interesse da pesquisa, de acordo com o amplo espectro de leitores nacionais e internacionais da Revista, inserindo-se no debate teórico de sua área. O periódico conta com Corpo Editorial, representado por uma Editora-Chefe, três Editores Assistentes e 17 Editores de Área, distribuídos entre cada um dos grandes segmentos desta Ciência (Taxonomia de Fanerógamos, Taxonomia de Criptógamos, Fisiologia, Ecologia, Botânica Estrutural e Etnobotânica), cada representante com mandato de três anos e eleitos durante a Assembléia Geral Ordinária que acontece nos Congressos Nacionais.

Acta Botanica Brasilica publica trabalhos originais, comunicações curtas e resumos de teses e dissertações em Português, Inglês ou Espanhol, que versem sobre assuntos da botânica básica e aplicada.

A abreviatura de seu título é Acta Bot. Bras., que deve ser usada em bibliografias, notas de rodapé e em referências e legendas bibliográficas.

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Todas as Aves do Brasil – Guia de Campo para Identificação; 2ª Edição; [Deodato Souza]; 2004

2ª Edição

Autor: Deodato Souza

Editora: DALL
Formato: 16×22,5 cm.
356 páginas em cores em papel couché. Mapa colorido com principais ecossistemas brasileiros.
Ilustrações Deodato Souza e Osmar Borges.

O Livro Todas as aves do Brasil: guia de identificação é de autoria do ornitólogo Deodato Souza. O mais completo e ilustrado guia de aves do Brasil, com 356 páginas coloridas, com mapas de distribuição e rotas migratórias. Contêm 10 ilustrações por página, ao todo 158 pranchas coloridas. Foram adicionadas 200 novas ilustrações e nenhuma espécie ficou de fora, totalizando cerca de 2.600 ilustrações, o que o faz o guia mais ilustrado até hoje publicado em um só volume.

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Birds of Brazil;[Kevin Zimmer and Andrew Whittaker]; 2011; Hardcover

In Preparation

Price to be announced

Book Details Summary: 

The title of this book is Birds of Brazil and it was written by Kevin Zimmer. This edition of Birds of Brazil is in a Hardcover format. This books publish date is May 2011 and it has a suggested retail price of $75.00. There are pages in the book and it was published by Princeton Univ Pr. The 10 digit ISBN is 0691113165 and the 13 digit ISBN is 9780691113166.

O livro está sendo produzido por dois ornitólogos — Kevin Zimmer, autor e guia turístico, e Andrew Whitaker, especialista em pássaros da Amazônia que vive em Manaus.

Segundo Robert Kirk, editor sênior da Princeton University Press, responsável pela publicação, o livro deverá ter dois volumes: um volume maior de referência, com textos e mapas detalhados; e um guia de campo menor com textos mais curtos, mapas e cerca de 190 chapas em cor. Se houver financiamento, o livro poderá eventualmente ser traduzido para o português.

Kevin Zimmer has authored three books and numerous papers dealing with field identification and bird-finding in North America. His book, Birding in the American West: A Handbook, deals with finding and identifying birds in the western United States. Living in Alaska contributed to his affection for the Far North, where he has anchored VENT's tour program since 1986. For the past 20+ years he has concentrated his attention on the Neotropics, particularly on Brazil, Costa Rica, Panama, Peru, and Venezuela. He has directedVENT's Brazil program since 1991. Kevin has a PhD in biology (research emphasis in Avian Evolutionary Ecology) from New Mexico State University, and is currently a field associate of Cornell's Laboratory of Ornithology, a Research Associate of the Los Angeles County Museum of Natural History, an elective member of the American Ornithologists' Union, and a member of both the A.O.U. South American Check-list Committee (SACC) and the American Birding Association (ABA) Check-list Committee. He has authored numerous technical papers on the taxonomy, distribution, and behavior of Neotropical birds, particularly those of the Amazon basin. In 2003 he completed (with co-author Mort Isler) the major chapter on the Thamnophilidae (antbirds) for the prestigious Handbook of Birds of the World series. In 2006, he and Curtis Marantz coauthored a six-CD compilation of Bird Voices of Alta Floresta and Southeastern Amazonian Brazil (produced by the Cornell Laboratory of Ornithology's Macaulay Library of Natural Sounds) that represents the most comprehensive set of commercially available bird recordings for any part of the Amazon Basin. He and Andrew Whittaker are currently at work on a comprehensive field guide to the birds of Brazil, to be published by Princeton University Press. Kevin lives in Atascadero, California with his wife Susan. Their daughter Marina completed her master's degree in psychology at Dominican University in May 2008. Recently married, she and her husband Ryan are now living in Napa, California.

Andrew Whittaker's passion for birding and natural history started at the early age of seven in the UK. Since 1982 Andy has worked and studied birds worldwide in Canada, Israel, Borneo, and the UK before moving to Brazil where he has remained based in Amazonian Brazil for the last 23 years. Research work in the Brazilian rainforest for the Smithsonian Institution has made Andy an authority on Amazonian birds and the region's natural history, and he has authored many technical publications on the region. He was a consultant for the prestigious Life of Birds series by David Attenborough, and is a research associate of the Museum Goeldi, in Belém. At present Andy is working with Kevin Zimmer on a comprehensive field guide to the birds of Brazil. Andy has led VENT tours for 19 years throughout South and Central American countries, the UK, and the Antarctic. He immensely enjoys sharing his fascination and knowledge of Neotropical birds, animals, and their conservation with others. Andy's special interest is bird vocalizations; his knowledge of Neotropical voices has enabled him to make several important ornithological discoveries, including species new to science, the rediscovery of species thought lost to science, and the addition of 19 species to the Brazilian list. Andy is a member of the Brazilian Ornithological Committee, and lives in Manaus, Amazonas with his children Steven, Luana, and Suzana.

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