Friday, February 18, 2011

IPC Document Revision Table Updated 2010 - 2011

IPC Document Revision Table Updated 2010 - 2011  
Product ID
Document Name
Status
J-STD-001
Requirements for Soldered Electrical and Electronic Assemblies
  • Rev. E  4/10
  • Rev D Amend 1  04/08
  • Rev D 2/05
  • Rev. C 3/00
  • Rev. B 10/96
  • Rev. A 1/95
  • Orig. 4/92; Supersedes IPC-S-815
J-STD-001CS
Space Applications Electronic Hardware Addendum for J-STD-001C
  • 4CS 1/04
J-STD-001DS
Space Applications Electronic Hardware Addendum for J-STD-001D
  • Amend 1 09/09
  • DS 11/06
IPC-HDBK-001
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies
  • Amend 2  10/05
  • Amend. 1  12/00
  • Orig. 3/98
SMC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
  • Orig. 1/89
IT-WP-001
Myths of E-Commerce
  • Orig. 9/00
SMC-WP-001
Soldering Capability White Paper Report
  • Orig. 8/91
SMEMA 1.2
Mechanical Equipment Interface Standard
  • Update IPC-SMEMA-9851
JP002
Current Tin Whiskers Theory and Mitigation Practices Guideline
  • Orig.  3/06
J-STD-002
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
  • Rev. C Amend. 1 10/08
  • Rev. C 12/07
  • Rev. B  2/03
  • Rev. A 10/98
  • Orig. 4/92; Supersedes IPC-S-805
SMC-WP-002
An Assessment of the Use of Lead in Electronic Assembly
  • Orig. 8/92
J-STD-003
Solderability Tests for Printed Boards
  • Rev. B  2/07
  • Rev. A  2/03
  • Original 4/92; Supersedes IPC-S-804
SMC-WP-003
Chip Mounting Technology
  • Orig. 8/93
SMEMA 3.1
Fiducial Mark Standard
J-STD-004
Requirements for Soldering Fluxes
  • Rev. B 12/08
  • Rev. A  1/04
  • Orig. 1/95; Supersedes IPC-SF-818
SMC-WP-004
Design for Success
  • Orig. 4/97
SMEMA 4
Reflow Terms and Definitions
  • Orig.
J-STD-005
Requirements for Soldering Pastes
  • Amend. 1  6/96
  • Orig. 1/95; Supersedes IPC-SP-819
SMC-WP-005
PWB Surface Finishes
  • Orig. 4/97
IPC-HDBK-005
Guide to Solder Paste Assessment
  • Orig. 1/06
SMEMA 5
Screen Printing Terms and Definitions
  • Orig.
J-STD-006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
  • Rev. B Amends 1 & 2 10/09
  • Rev. B Amend. 1  6/08
  • Rev. B  1/06
  • Rev. A  5/01
  • Orig. 1/95
SMEMA 6
Electronics Cleaning Terms and Definitions
  • Orig.
SMEMA 7
Fluid Dispensing Terms and Definitions
  • Orig.
WP-008
Setting up Ion Chromatography Capability
  • Orig. 12/05
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
  • Orig. 1/96
J-STD-013
Implementation of Ball Grid Array and Other High Density Technology
  • Orig. 7/96
IPC-DRM-18
Component Identification Desk Reference Manual
  • Rev. H 11/07
  • Rev. G 9/03
  • Rev. F 8/01
  • Rev. E 8/00
  • Rev. D 7/99
  • Rev. C 7/98
  • Rev. B 2/97
  • Rev. A 4/96
  • Orig. 9/95
J-STD-020
Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices
  • Rev D Amend 1  3/08
  • Rev D  8/07
  • Rev. C 7/04
  • Rev. B 7/02
  • Rev. A 4/99
  • Orig. 10/96
J-STD-026
Semiconductor Design Standard for Flip Chip Applications
  • Orig. 8/99
J-STD-027
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
  • Orig.  2/03
J-STD-028
Performance Standard for Flip Chip Scale Bumps
  • Orig. 8/99
J-STD-030
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
  • Orig. 9/05
J-STD-032
Performance Standard for Ball Grid Array Bumps and Columns
  • Orig. 6/02
J-STD-033
Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices
  • Rev B Amend 1  1/07
  • Rev B 10/05
  • Rev. A 7/02
  • Orig. 4/99
J-STD-035
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
  • Orig. 4/99
IPC-0040
Optoelectronic Assembly and Packaging Technology  
  • Orig. 5/03
IPC-DRM-40
IPC-DRM-PTH
Through-Hole Solder Joint Evaluation Desk Reference Manual
  • Rev D 11/05
  • Renamed to DRM-PTH
  • Rev. E 2/02
  • Rev. D 7/00
  • Rev. C 9/99
  • Rev. B 1/99
  • Rev. A 8/97
  • Orig. 5/97
IPC-T-50
Terms and Definitions Interconnecting and Packaging Electronic Circuits
  • Rev. H  7/08
  • Rev. G 12/03
  • Rev. F 6/96
  • Rev. E 7/92
  • Rev. D 11/88
  • Rev. C 3/85
  • Rev. B 6/80
  • Rev. A 8/76
  • Orig. 8/75
IPC-DRM-53
Introduction to Electronics Assembly
  • Orig. 6/00
IPC-DRM-56
IPC-DRM-WHA
Wire Preparation & Crimping
  • Rev A 11/06
  • Renamed DRM-WHA
  • Orig.  7/02
IPC-SC-60
Post Solder Solvent Cleaning Handbook
  • Rev. A 8/99
  • Orig. 4/87
IPC-SA-61
Post-Solder Semi-Aqueous Cleaning Handbook
  • Rev. A 6/02
  • Orig. 7/95
IPC-AC-62
Post Solder Aqueous Cleaning Handbook
  • Rev. A 1/96
  • Orig. 12/86
IPC-CH-65
Guidelines for Cleaning of Printed Boards and Assemblies
  • Rev. A 9/99
  • Orig. 12/90
IPC-CS-70
Guidelines for Chemical Handling Safety in Printed Board Manufacturing
  • Orig. 8/88 Obsolete without replacement
J-STD-075
Classification of Non-IC Electronic Components for Assembly Processes
  • Orig. 08/08
IPC-CM-78
Guidelines for Surface Mounting and Interconnecting Chip Carriers
  • Superseded by IPC-SM-780
  • Rev. C - 3/88
  • Orig. 11/83
IPC-MP-83
IPC Policy on Metrication
  • Orig. 8/85 Obsolete without replacement
IPC-PC-90
General Requirements for Implementation of Statistical Process Control
  • Superseded by IPC-9191
  • Orig. 10/90
IPC-QS-95
General Requirements for Implementation of ISO 9000 Quality Systems
  • Obsolete without replacement
  • Orig. 4/93
IPC-L-108
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards
  • Superseded by IPC-4101
  • Rev. B  6/90
  • Rev. A 10/80
  • Orig. 3/76
IPC-L-109
Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards
  • Superseded by IPC-4101
  • Rev. B  7/92
  • Rev. A 10/80
  • Orig. 3/76
IPC-L-110
Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards
  • Rev. A Superseded by IPC-L-109 and IPC-4101
IPC-CC-110
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
  • Superseded by IPC-4121
  • Rev. A 12/97
  • Orig. 1/94
IPC-L-112
Specification for Composite Metal Clad Base materials for Printed Boards
  • Superseded by IPC-4101
  • Rev. A 6/92
  • Orig. 7/81
IPC-L-115
Specification for Rigid Metal Clad Base Materials for Printed Boards
  • Superseded by IPC-4101
  • Rev. B 4/90
  • Rev. A 10/80
  • Orig. 3/77
IPC-L-120
Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates
  • Obsolete without replacement
IPC-L-125
Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections
  • Superseded by IPC-4103
  • Rev. A 7/92
  • Orig. 8/83
IPC-L-130
Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards
  • Superseded by IPC-L-108 and IPC-4101
  • Orig. 1/77
IPC-DD-135
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
  • Orig. 8/95
IPC-EG-140
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
  • Superseded by IPC-4412
  • Amend. 1 & 2 6/97
  • Orig. 3/88
IPC-SG-141
Specification for Finished Fabric Woven from "S" Glass for Printed Boards
  • Orig. 2/92
IPC-A-142
Specification for Finished Fabric Woven from Aramid for Printed Boards
  • Orig. 6/90
IPC-QF-143
General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
  • Orig. 2/92
IPC-CF-148
Resin Coated Metal for Printed Boards
  • Superseded by IPC-4563
  • Rev. A 9/98
  • Orig. 6/90
IPC-MF-150
Metal Foil for Printed Wiring Applications
  • Superseded by IPC-4562
  • Rev. F 10/91 Changed from CF-150 to MF-150
  • Rev. E 5/81
  • Rev. D 3/76
  • Rev. C 8/74
  • Rev. B 2/71
  • Rev. A 9/67
  • Orig. 8/66
IPC-CF-152
Composite Metallic Material Specification for Printed Wiring Boards
  • B 12/97
  • A 1/94
  • Orig. 6/90
IPC-FC-203
Specification for Flat Cable, Round Conductor, Ground Plane
  • Obsolete 7/96
  • Orig. 7/85
IPC-FC-210
Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)
  • Obsolete 7/96
  • Orig. 9/85
IPC-FC-213
Performance Specification for Flat Undercarpet Telephone Cable
  • Obsolete 7/96
  • Orig. 9/84
IPC-FC-217
General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable
  • Obsolete 7/96
  • Reaffirmed 4/90
  • Orig. 8/82
IPC-FC-218B/EIA-RS-429
General Specification for Connectors, Electrical Flat Cable Type
  • Obsolete 7/96
  • Reaffirmed 05/91
  • Reaffirmed 11/81
  • Orig. 7/76
IPC-FC-219
Environment Sealed Flat Cable Connectors for use in Aerospace Applications
  • Obsolete 7/96
  • Orig. 5/84
IPC-FC-220
Specification for Flat Cable, Flat Conductor, Unshielded
  • Obsolete 7/96
  • Rev. C 7/85
  • Rev. B 8/75
  • Rev. A 1/74
  • Orig. 5/70
IPC-FC-221
Specification for Flat-Copper Conductors for Flat Cables
  • Obsolete 7/96
  • Rev. A 5/84
  • Orig. 8/75
IPC-FC-222
Specification of Flat Cable Round Conductor, Unshielded
  • Obsolete 7/96
  • Reaffirmed 5/91
  • Orig. 6/80
IPC-FC-225
Flat Cable Design Guide
  • Obsolete (date)
  • Reaffirmed 10/85
  • Orig. 8/75
IPC-FC-231
Flexible Base Dielectrics for Use in Flexible Printed Wiring
  • Superseded by IPC-4202
  • Amend. 10/95
  • Rev. C 4/92
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
IPC-FC-232
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films
  • Superseded by 4203
  • Amend. 10/95
  • Rev. C 6/94
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
IPC-FC-233
Flexible Adhesive Bonding Films
  • Incorporated into IPC-FC-232B
IPC-FC-234
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits
  • Orig. 12/97
IPC-FC-240
Single sided flex
  • Superseded by IPC-6013
  • Incorporated into FC-250
  • Rev. B 1/74
  • Rev. A 5/69
  • Orig. 12/65
IPC-FC-241
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
  • Superseded by IPC-4204
  • Amend. 10/95
  • Rev. C 4/92
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
IPC-RF-245
Performance Specification for Rigid-Flex Printed Boards
  • Superseded by IPC-6013
  • Orig. 4/87
IPC-D-249
Design Standard for Flexible Single-and Double-Sided Printed Boards
  • Superseded by IPC-2223
  • Orig. 1/87
IPC-FC-250A
Specification for Single - and Double-Sided Flexible Printed Wiring
  • Superseded by IPC-6013
  • Rev. A 9/86
  • Orig. 9/86
IPC-FA-251
Guidelines for Single and Double Sided Flex Circuits
  • Orig. 2/92
IPC-D-275
Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies
  • Superseded by IPC-2221 and 2222
  • Supersedes IPC-D-319 and IPC-D-949
  • Amendment 1  4/96
  • Orig. 9/91
IPC-RB-276
Qualification and Performance Specification for Rigid Printed Boards
  • Superseded by IPC-6011 and IPC-6012
  • Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
IPC-D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
  • Orig. 7/96
IPC-D-300
Printed Board Dimensions and Tolerances
  • Superseded by IPC-2615
  • Rev. G 1/84
  • Rev. F 11/74
  • Rev. E 10/70
  • Rev. D 1/70
  • Rev. C 10/65
  • Rev. B 1/64
  • Rev. A 7/61
  • Orig. 8/60
IPC-D-310
Guidelines for Phototool Generation and Measurement Techniques
  • Rev. C  6/91
  • Rev. B 12/85
  • Rev. A 12/77
  • Orig. 9/69
IPC-A-311
Process Control Guidelines for Phototool Generation and Use
  • Orig. 3/96
IPC-D-316
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates
  • Superseded by IPC-2252
  • Orig. 5/95
IPC-D-317
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques
  • Superseded by IPC-2251
  • Rev. A 1/95
  • Orig. 4/90
IPC-HF-318
Microwave End Product Board Inspection and Test
  • Superseded by IPC-6018
  • Rev. A 12/91
  • Orig. 6/85
IPC-D-319
Design Standard for Rigid Single-and Double-Sided Printed Boards
  • Superseded by IPC-D-275, then by IPC-2221/2222
  • Orig. 1/87
IPC-SD-320
Performance Specification for Rigid Single- and Double-Sided Printed Boards
  • Superseded by IPC-RB-276
  • Supersedes IPC-TC-500
  • Rev. B 11/86
  • Rev. A 3/81
  • Orig. 1/77
IPC-D-322
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
  • Reaffirmed 9/91
  • Orig. 8/84
IPC-MC-324
Performance Specifications for Metal Core Boards
  • Superseded by IPC-6011 and IPC-6012
  • Orig. 10/88
IPC-D-325
Documentation Requirements for Printed Boards, Assemblies and Support Drawings
  • Rev. A 5/95
  • Orig. 1/87
IPC-D-326
Information Requirements for Manufacturing Printed Board Assemblies
  • Rev. A 1/04
  • Orig. 4/91
IPC-D-330
Design Guide Manual
  • Orig. 1/92
IPC-PD-335
Electronic Packaging Handbook
  • Orig. 12/89
IPC-NC-349
Computer Numerical Control Formatting for Drillers and Routers
  • Orig. 8/85
IPC-D-350
Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1
  • Rev. D 7/92
  • Rev. C 10/85
  • Rev. B 8/77
  • Rev. A 2/75
  • Orig. 8/72
IPC-D-351
Printed Board Drawings in Digital Form
  • Orig. 8/85
IPC-D-352
Electronic Design Data Description for Printed Boards in Digital Form
  • Orig. 8/85
IPC-D-354
Library Format Description for Printed Boards in Digital Form
  • Orig. 2/87
IPC-D-355
Printed Board Assembly Description in Digital Form
  • Orig. 1/95
IPC-D-356
Bare Board Electrical Test Information in Digital Form
  • Rev. B 10/02
  • Rev. A 1/98
  • Orig. 3/92
IPC-AM-361
Specification for Rigid Substrates for Additive Process Printed Boards
  • Superseded by IPC-4101
  • Orig. 1/82
IPC-MB-380
Guidelines for Molded Interconnection Devices
  • Orig. 10/90
IPC-D-390
Automated Design Guidelines
  • Rev. A 2/88
  • Orig. 7/74
IPC-C-406
Design and Application Guidelines for Surface Mount Connectors
  • Orig. 1/90
IPC-CI-408
Design and Application Guidelines for the Use of Solderless Surface Mount Connectors
  • Orig. 1/94
IPC-BP-421
General Specification for Rigid Printed Board Backplanes with Press Fit Contacts
  • Obsolete without replacement
  • Reaffirmed 4/90
  • Orig. 10/80
IPC-D-422
Design Guide for Press Fit Rigid Printed Board Backplanes
  • Orig. 9/82
IPC-DW-424
General Specification for Encapsulated Discrete Wire Interconnection Boards
  • Orig. 1/95
IPC-DW-425
Design and End Product Requirements for Discrete Wiring Boards
  • Rev. A 5/90
  • Orig. 9/82
IPC-DW-426
Specifications for Assembly of Discrete Wiring
  • Orig. 12/87
IPC-TR-460
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
  • Rev. A 2/84
  • Orig. 1973
IPC-TR-461
Solderability Evaluation of Thick and Thin Fused Coatings
  • Orig. 3/79
IPC-TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
  • Orig. 10/87
IPC-TR-464
Accelerated Aging for Solderability Evaluations
  • Rev. A 12/87
  • Orig. Pub.4/84
IPC-TR-465-1
Round Robin Test on Steam Ager Temperature Control Stability
  • Orig. 1993
IPC-TR-465-2
The Effect of Steam Aging Time and Temperature on Solderability Test Results
  • Orig. 1993
IPC-TR-465-3
Evaluation of Steam Aging on Alternative Finishes, Phase IIA
  • Orig. 7/96
IPC-TR-466
Wetting Balance Standard Weight Comparison Test
  • Orig. 4/95
IPC-TR-467
Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D
  • Orig. 10/96
IPC-TR-468
Factors Affecting Insulation Resistance Performance of Printed Boards
  • Orig. 3/79
IPC-TR-470
Thermal Characteristics of Multilayer Interconnection Boards
  • Orig. 1/74
IPC-TR-474
An Overview of Discrete Wiring Techniques
  • Obsolete without replacement
  • Reprint 1984
  • Orig. 3/79
IPC-TR-476
How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles
  • Rev. A 6/84 (new title)
  • Orig. 9/77
IPC-TR-480
Results of Multilayer Test Program Round Robin IV Phase I
  • Obsolete without replacement
  • Orig. 9/75
IPC-TR-481
Results of Multilayer Test Program Round Robin V
  • Orig. 4/81
IPC-TR-482
New Developments in Thin Copper Foils
  • Orig. 1/76
IPC-TR-483
Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program
  • Rev. A 3/91
  • Addendums 10/87
  • Orig. 4/84
IPC-TR-484
Results of IPC Cooper Foil Ductility Round Robin Study
  • Orig. 4/86
IPC-TR-485
Results of Cooper Foil Rupture Strength Test Round Robin Study
  • Orig. 3/85
IPC-TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
  • Orig. 7/01
IPC-TR-549
Measles in Printed Wiring Boards
  • Orig. 11/78
IPC-TR-551
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
  • Orig. 7/93
IPC-DR-570
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards
  • Obsolete without replacement
  • Rev. A 4/84
  • Orig. 1/79
IPC-DR-572
Drilling Guidelines for Printed Boards
  • Rev A  3/07
  • Orig. 4/88
IPC-TR-576
Additive Process Evaluation
  • Obsolete without replacement
  • Orig. 9/77
IPC-TR-578
Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards
  • Orig. 9/84
IPC-TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
  • Orig. 9/88
IPC-TR-580
Cleaning and Cleanliness Test Program Phase 1 Test Results
  • Orig. 10/89
IPC-TR-581
IPC Phase 3 Controlled Atmosphere Soldering Study
  • Orig. 8/94
IPC-TR-582
IPC Phase 3 No-Clean Flux Study
  • Orig. 11/94
IPC-TR-583
An In-Depth Look At Ionic Cleanliness Testing
  • Orig. 7/02
IPC-WP/TR-584
IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies
  • Rev A  8-07
  • Orig.  4/03
IPC-TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability
  • Orig.  5/06
IPC-TR-586
Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A)
  • Orig. 5/09
IPC-A-600
Acceptability of Printed Boards
  • Rev. H  4/10
  • Amend. 1 01/08
  • Rev. G  7/04
  • Rev. F 11/99
  • Rev. E 8/95
  • Rev. D '89
  • Rev. C '78
  • Rev. B '74
  • Rev. A '70
  • Orig. '64
IPC-SS-605
Printed Board Quality Evaluation Slide Set
  • Obsolete without replacement
IPC-QE-605
Printed Board Quality Evaluation Handbook
  • Rev. A 2/99
J-STD-609
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices
  • Rev. A  2/10
  • Orig. 5/07; supersedes IPC-1066
IPC-A-610
Acceptability of Electronic Assemblies
  • Rev E  4/10
  • Rev D Amend 1 4/08
  • Rev. D 2/05
  • Rev. C 1/00
  • Rev. B 12/94
  • Rev. A 3/90
  • Orig. 8/83
IPC-A-610DC
IPC-A-610D Telecom Addendum
  • Orig. 8/09
IPC-HDBK-610
Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)
  • Amend 1  10/05
  • Orig. 9/02
IPC-QE-615
Assembly Quality Evaluation Handbook
  • Obsolete without replacement
IPC/WHMA-A-620
Requirements and Acceptance for Cable and Wire Harness Assemblies
  • Rev A 7/06
  • Orig. 1/02
IPC-AI-640
User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates
  • Obsolete without replacement
  • Orig. 1/87
IPC-AI-641
User's Guidelines for Automated Solder Joint Inspection
  • Obsolete without replacement
  • Orig. 1/87
IPC-AI-642
User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's
  • Obsolete without replacement
  • Orig. 10/88
IPC-OI-645
Standard for Visual Optical Inspection Aids
  • Orig. 10/93
IPC-TM-650
Test Methods Manual
  • Updated per test method
IPC-ET-652
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
  • Superseded by IPC-9252
  • Orig. 10/90
IPC-QL-653
Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material
  • Rev. A 11/97
  • Orig. 8/88
IPC-MI-660
Incoming Inspection of Raw Materials Manual
  • Orig. 2/84
IPC-R-700
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies
  • Superseded by IPC-7711A/7721A
  • Rev. C 1/88
  • Rev. B 9/77
  • Rev. A 12/71
  • Orig. 9/67
IPC-TA-720
Technology Assessment Handbook on Laminates
  • Orig. '86
IPC-TA-721
Technology Assessment Handbook on Multilayer Boards
  • Orig. '88
IPC-TA-722
Technology Assessment of Soldering
  • Orig. '90
IPC-TA-723
Technology Assessment Handbook on Surface Mounting
  • Orig. '91
IPC-TA-724
Technology Assessment Series on Cleanrooms
  • Orig. 4/98
IPC-PE-740
Troubleshooting Guide for Printed Board Manufacture and Assembly
  • Rev. A 12/97
  • Orig. 1/85
IPC-CM-770
Printed Board Component Mounting
  • Rev. E 1/04
  • Rev. D 1/96
  • Rev. C 1/87
  • Rev. B 10/80
  • Rev. A 3/76
  • Orig. 9/68
IPC-SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
  • Orig. 3/88
IPC-SM-782
Surface Mount Design and Land Pattern Standard
  • Superseded by IPC-7351
  • Amend. 2  4/99
  • Amend. 1  10/96
  • Rev. A 8/93
  • Orig. 3/87
IPC-SM-784
Guidelines for Chip-on-Board Technology Implementation
  • Orig. 11/90
IPC-SM-785
Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments
  • Orig. 11/92
IPC-SM-786
Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs
  • Superseded by J-STD-020 and J-STD-033
  • Rev. A 1/95
  • Orig. 12/90
IPC-MC-790
Guidelines for Multichip Module Technology Utilization
  • Orig. 8/92
IPC-S-801
  • Superseded by IPC-804 and J-STD-003
IPC-S-803
  • Superseded by IPC-804 and J-STD-003
IPC-S-804
Solderability Test Methods for Printed Wiring Boards
  • Superseded by J-STD-003
  • Rev. A 1/87
  • Orig. 1/82
IPC-S-805
Solderability Tests for Component Leads and Terminations
  • Superseded by
  • J-STD-002
  • Orig. 1/85
IPC-MS-810
Guidelines for High Volume Microsection
  • Orig. 10/93
IPC-S-815
General Requirements for Soldering Electronic Interconnections
  • Superseded byJ-STD-001
  • Rev. B 12/87
  • Rev. A 6/81
  • Orig. 11/77
IPC-S-816
SMT Process Guideline and Checklist
  • Orig. 7/93
IPC-SM-817
General Requirements for Dielectric Surface Mounting Adhesives
  • Orig. 11/89
IPC-SF-818
General Requirement for Electronic Soldering Fluxes
  • Superseded by J-STD-004
  • Rev. 12/91
  • Orig. 2/88
IPC-SP-819
General Requirements and Test Methods for Electronic Grade Solder Paste
  • Superseded by J-STD-005
  • Orig. 10/88
IPC-AJ-820
Assembly and Joining Manual
  • Orig. 8/96
IPC-CA-821
General Requirements for Thermally Conductive Adhesives
  • Orig. 1/95
IPC-CC-830
Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
  • Amend. 1 10/08
  • Rev B 08/02
  • Amend. 1 7/99
  • Rev. A 10/98
  • Orig. 1/84
IPC-HDBK-830
Conformal Coating Handbook
  • Orig. 10/02
IPC-SM-839
Pre and Post Solder Mask Application Cleaning Guidelines
  • Orig. 4/90
IPC-SM-840
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards
  • Rev. D 4/07
  • Amend. 1 6/00
  • Rev. C 1/96
  • Rev. B 5/88
  • Rev. A 7/83
  • Orig. 11/77
IPC-HDBK-840
Solder Mask Handbook
  • Orig. 09/06
IPC-H-855
Hybrid Microcircuit Design Guide
  • Obsolete without replacement
  • Orig. 10/82
IPC-D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
  • Orig. 12/89
IPC-HM-860
Specification for Multilayer Hybrid Circuits
  • Orig. 1/87
IPC-TF-870
Qualification and Performance of Polymer Thick Film Printed Boards
  • Orig. 11/89
IPC-ML-910
Design and End Production Specification for Rigid Multilayer Printed Boards
  • Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011 for End Product Specification
  • Rev. A  8/76
  • Orig.  6/68
IPC-D-949
Design Standard for Rigid Multilayer Printed Boards
  • Superseded by IPC-D-275 and subsequently by IPC-2221/2222
  • Orig. 1/87
IPC-ML-950
Performance Specification for Rigid Multilayer Printed Boards
  • Superseded by IPC-RB-276 and subsequently IPC-6011/6012
  • Rev. C 11/8
  • Rev. B 12/77
  • Rev. A 9/70
  • Orig. 1/66
IPC-ML-960
Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards
  • Orig. 7/94
IPC-ML-975
End Product Documentation Specification for Multilayer Printed Wiring Boards
  • Superseded by IPC-D-325
  • Orig. 9/69
IPC-ML-990
Performance Specification for Flexible Multilayer Wiring
  • Superseded by IPC-6011
  • Orig. 9/72
IPC-1043
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1
  • Orig. 8/92
IPC-1044
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2
  • Orig. 10/92
IPC-1065
Material Declaration Handbook
  • Orig. 1/05
IPC-1066
Labeling of PCBs and Assemblies
  • Superseded by J-STD-609
  • Orig. 12/04
IPC-TP-1090
The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002
  • Orig. 7/96
IPC-TP-1103
Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads
  • Obsolete without replacement
IPC-TP-1114
The Layman's Guide to Qualifying a Process to J-STD-001B
  • Orig. 1/98
IPC-TP-1115
Selection and Implementation Strategy for A Low-Residue No-Clean Process
  • Orig. 12/98
IPC-1131
IT Guidelines for PWB Manufacturers
  • Orig. 4/00
IPC-1331
Voluntary Safety Standard for Electrically Heated Process Equipment
  • Orig. 3/00
IPC-1601
Printed Board Handling and Storage Guidelines
  • Orig. 8/10
IPC-1710
OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)
  • Rev. A 7/04
  • 12/97 updated
  • Orig. 2/94
IPC-1720
Assembly Qualification Profile (AQP)
  • Rev. A 7/04
  • Orig. 7/96
IPC-1730
Laminator Qualification Profile (LQP)
  • Rev. A 6/00
  • Orig. 1/98
IPC-1731
Strategic Raw Materials Supplier Qualification Profile
  • Orig. Pub. 6/00
IPC-1751
Generic Requirements for Declaration Process Management
  • Rev. A  2/10
  • Vers. 1.1  3/07
  • Orig. Pub.  3/06
IPC-1752
Materials Declaration Management (Includes 2 PDF forms)
  • Rev. A 2/10
  • Vers. 1.1 3/07
  • Orig. Pub. 3/06
IPC-1756
Manufacturing Process Data Management
  • Orig. 4/10
IPC-2141
Controlled Impedance Circuit Boards and High Speed Logic Design
  • Rev. A 3/04
  • Orig. 4/96
IPC-2152
Standard for Determining Current Carrying Capacity in Printed Board Design
  • Orig. 8/09
IPC-2221
Generic Standard on Printed Board Design
  • Rev. A 5/03
  • Amend. 1 01/00
  • Orig. 2/98; Supersedes IPC-D-275
IPC-2222
Sectional Design Standard for Rigid Organic Printed Boards
  • Orig. 2/98; Supersedes IPC-D-275
IPC-2223
Sectional Design Standard for Flexible Printed Boards
  • Rev. B 5/08
  • Rev. A 6/04
  • Orig. 11/98; Supersedes IPC-D-249
IPC-2224
Sectional Standard for Design of PWBs for PC Cards
  • Orig. 1/98
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
  • Orig. 5/98
IPC-2226
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures
  • Orig. 4/03
IPC-2251
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques
  • Orig. 12/03
IPC-2252
Design and Manufacturing Guide for RF/Microwave Circuit Boards
  • Orig. 7/02
IPC/JPCA-2315
Design Guide for High Density Interconnects (HDI) and Microvia
  • Orig. 6/00
IPC-2316
Design Guide for Embedded Passive Device Printed Boards
  • Orig. 3/07
IPC-2501
Definition for Web-based Exchange of XML Data
  • Orig. 7/03
IPC-2511
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology
  • Rev. B  1/02
  • Rev A  1/00
  • Orig. 1 1/98
IPC-2512
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description
  • Rev A 11/00
  • Orig. 11/98
IPC-2513
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
  • Rev A 11/00
IPC-2514
Sectional Requirements for Implementation of Printed Board Manufacturing Data Description
  • Rev A 11/00
IPC-2515
Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description
  • Rev A 11/00
IPC-2516
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
  • Rev A 11/00
IPC-2517
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description
  • Rev A 11/00
IPC-2518
Sectional Requirements for Implementation of Part List Product Data Description
  • Rev A 11/00
IPC-2524
PWB Fabrication Data Quality Rating System
  • Orig. 2/99
IPC-2531
Standard Recipe File Format Specification
  • Orig. 3/99
IPC-2541
Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication
  • Orig. 10/01
IPC-2546
Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication
  • Amend. 1  01/03
  • Amend. 2  01/05
  • Orig. 10/01
IPC-2547
Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication
  • 1/02
IPC-2571
Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)
  • 11/01
IPC-2576
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Exchange (PDX)
  • 11/01
IPC-2578
Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)
  • 11/01
IPC-2581
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring)
  • Amend 1  5/07
  • Orig. 3/04
IPC-2582
Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description
  • Orig. 5/07
IPC-2583
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description
  • Orig. 5/07
IPC-2584
Sectional Requirements for Implementation of Printed Board Fabrication Data Description
  • Orig. 5/07
IPC-2588
Sectional Requirements for Implementation of Part List Product Data Description
  • Orig. 5/07
IPC-2611
Generic Requirements for Electronic Product Documentation
  • Orig. 4/10
IPC-2612
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
  • Orig. 4/10
IPC-2612-1
Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
  • Orig. 4/10
IPC-2614
Sectional Requirements for Board Fabrication Documentation
  • Orig. 4/10
IPC-2615
Printed Board Dimensions and Tolerances
  • Orig. 6/00; Supersedes IPC-D-300
IPC-3406
Guidelines for Electrically Conductive Surface Mount Adhesives
  • Orig. 7/96
IPC-3408
General Requirements for Anistropically Conductive Adhesive Films
  • Orig. 11/96
IPC-4101
Specification for Base Materials for Rigid and Multilayer Boards
  • Rev. C 8/09
  • Rev. B Amends 1&2  4/07
  • Rev. B Amend 1  2/07
  • Rev. B  6/06
  • Rev. A Amend 1 6/02
  • Rev. A 6/02
  • Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
  • Orig. 12/97
IPC-4103
Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection
  • Orig. 01/02; Supersedes IPC-L-125
IPC/JPCA-4104
Specification for High Density Interconnect (HDI) and Microvia Materials
  • Orig. 5/99
IPC-4110
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
  • Orig. 8/98
IPC-4121
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
  • Orig. 1/00; Supersedes IPC-CC-110A
IPC-4130
Specification and Characterization Methods for Nonwoven "E" Glass Mat
  • Orig. 9/98
IPC-4202
Flexible Base Dielectrics for Use in Flexible Printed Wiring
  • Rev. A  4/10
  • Orig. 5/02; Supersedes IPC-FC-231C
IPC-4203
Adhesive Coated Dielectric Films for Use as Cover Sheets
  • Orig. 5/02; Supersedes IPC-FC-232C
IPC-4204
Flexible Metal-Clad Dielectrics for Use in Fabrication of
  • Orig. 5/02; Supersedes IPC-FC-241C
IPC-4411
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
  • Rev. A 11/03
  • Orig. 4/99
IPC-4412
Specification for Finished Fabric Woven form "E" Glass for Printed Boards
  • Rev. A Amend 2  5/09
  • Rev. A Amend 1  3/08
  • Rev. A 1/06
  • Orig. 6/02; Supersedes IPC-EG-140A
IPC-4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
  • Orig. 10/02
IPC-4553
Specification for Immersion Silver Plating for Printed Circuit Boards
  • Rev. A 5/09
  • Orig. 6/05
IPC-4554
Specification for Immersion Tin Plating for Printed Circuit Boards
  • Orig. 2/07
IPC-4562
Metal Foil for Printed Wiring Applications
  • Rev. A 4/08
  • Amend. 1  5/05
  • Orig. 5/00; Supersedes IPC-MF-150F
IPC-4563
Resin Coated Copper Foil for Printed Boards Guideline
  • Orig. (replaces CF-148A) 11/07
IPC-4761
Design Guide for Protection of Printed Board Via Structures
  • Orig. 7/06
IPC-4781
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks
  • Orig. 5/08
IPC-4811
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
  • Orig. 4/08
IPC-4821
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
  • Amend. 1  4/10
  • Orig. 5/06
IPC-5701
Users Guide for Cleanliness of Unpopulated Printed Boards
  • Orig. 7/03
IPC-5702
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
  • Orig. 6/07
IPC-5704
Cleanliness Requirements for Unpopulated Printed Boards
  • Orig. 12/09
IPC-6011
Generic Performance Specification for Printed Boards
  • Orig. 7/96
IPC-6012
Qualification and Performance Specification for Rigid Printed Boards
  • Rev. C  4/10
  • Amend. 2  3/08
  • Rev. B with Amend 1  2/07
  • Rev. B 8/04
  • Amend. 1  7/00
  • Rev. A  10/99
  • Orig.  7/96
IPC-6013
Qualification and Performance Specification for Flexible Printed Boards
  • Rev B.  1/09
  • Rev. A with Amend. 2  4/06
  • Amend. 1  1/05
  • Rev. A  11/03
  • Supersedes IPC-RF-245 and IPC-FC-250
  • Amend. 1  4/00
  • Orig. 11/98
IPC-6015
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
  • Orig. 2/98
IPC-6016
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
  • Orig. 5/99
IPC-6017
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
  • Orig. 3/09
IPC-6018
Microwave End Product Board Inspection and Test
  • Rev. A  1/02
  • Orig. 1/98
IPC/JPCA-6202
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
  • Orig. 2/99
IPC/JPCA-6801
Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection
  • Orig. 1/00
IPC-7094
Design and Assembly Process Implementation for Flip Chip and Die Size Components
  • Orig. 1/09
IPC-7095
Design and Assembly Process Implementation for BGAs
  • Rev. B  3/08
  • Rev. A 11/04
  • Orig. 8/00
IPC-7351
Generic Requirements for Surface Mount Design and Land Pattern Standard
  • Rev. B 6/10
  • Rev. A  2/07
  • Supersedes IPC-SM-782A with Amendments 1 & 2
  • Orig.  2/05
IPC-7525
Guidelines for Stencil Design
  • Rev. A  2/07
  • Orig.  5/00
IPC-7526
Stencil and Misprinted Board Cleaning Handbook
  • Orig.  2/07
IPC-7530
Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes
  • Orig.  5/01
IPC-7711/7721
Rev B renamed to:
Rework, Repair and Modification of Electronic Assemblies
  • Rev B  11/07
  • Rev A  10/03
  • Orig.  4/98; Supersedes IPC-R-700C
IPC-7912
Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies
  • Rev. A  1/04
  • Orig.  7/00
IPC-8413-1
Specification for Manufacturing Process Carriers for Handling Optical Fiber
  • Orig.  4/03
IPC-8497-1
Cleaning Methods and Contamination Assessment for Optical Assembly
  • Orig. 12/05
IPC-9151
Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database
  • Rev. C 5/10
  • Rev. B  2/07
  • Rev. A 5/03
  • Orig.  6/02
IPC-9191
General Guideline for implementation of Statistical Process Control (SPC)
  • Supersedes IPC-PC-90
  • Orig. 11/99
IPC-9194
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
  • Orig.  9/04
IPC-9199
SPC Quality Rating
  • Orig.  9/02
IPC-9201
Surface Insulation Resistance Handbook
  • Rev A  8/07
  • Orig.  7/96
IPC-9251
Test Vehicles for Evaluating Fine Line Capability
  • Orig.  7/00
IPC-9252
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
  • Rev. A  11/08
  • Orig. 02/01; Supersedes IPC-ET-652A
IPC-9261
In-Process DPMO and Estimated Yield for PWAs
  • Rev. A 10/06
  • Orig. 3/02
IPC-9501
PWB Assembly Process Simulation for Evaluation of Electronic Components
  • Orig. 7/95
IPC-9502
PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components
  • Orig. 4/99
IPC-9503
Moisture Sensitivity Classification for Non-IC Components
  • Superseded by J-STD-075 08/08
  • Orig. 4/99
IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components
  • Orig. 6/98
IPC-9591
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
  • Orig.  4/06
IPC-9592
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
  • Rev. A  5/10
  • Orig.  9/08
IPC-9691
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
  • Rev A  8/07
  • Orig. 10/05
IPC-9701
Qualification and Performance Test Methods for Surface Mount Solder Attachments
  • Rev. A  2/06
  • Orig.  1/02
IPC/JEDEC-9702
Monotonic Bend Characterization of Board-Level Interconnects
  • Orig.  6/04
IPC/JEDEC-9703
Mechanical Shock Test Guidelines for Solder Joint Reliability
  • Orig.  3/09
IPC/JEDEC-9704
Printed Wiring Board Strain Gage Test Guideline
  • Orig.  6/05
IPC-9850
Surface Mount Equipment Performance Characterization
  • Orig.  7/02
IPC-SMEMA-9851
Equipment Interface Specification
  • Orig. 11/04
IPC-DRM-SMT
Surface Mount Solder Joint Evaluation Desk Reference Manual
  • Rev. C 11/05
  • Rev. B 4/00
  • Rev. A 3/99
  • Orig. 7/98
IPC-EMSI-TC
IPC Sample Master Ordering Agreement for EMS Companies and OEMs
  • Orig.  3/02
Roadmap
International Technology Roadmap for Electronic Interconnections
  • Updated 2009
  • Updated 2007
  • Updated 2005
  • Updated 2003
  • Updated 2001
  • Updated 9/97
  • Orig. 6/95

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